Study of Cu diffusion in an Al–1 wt.%Si–0.5 wt.%Cu bond pad with an Al–1 wt.%Si bond wire attached using scanning electron microscopy

RecordNumber :

1863

Author :

P. Cosemans, J. D'haen, A. Witvrouw, J. Proost, M. D'olieslaeger, W. De Ceuninck, K. Maex, and L. De Schepper

Title of Article :

Study of Cu diffusion in an Al–1 wt.%Si–0.5 wt.%Cu bond pad with an Al–1 wt.%Si bond wire attached using scanning electron microscopy

Title Of Journal :

Microelectronics Reliability

ISSN :

0026-2714

Volume :

Issue :

Page :

309-315

DOI :

10.1016/S0026-2714(97)00051-6

Year :

1998

Link To Document :